Asuka Group General Manager: Welcome to the 3D IC Era

2011 will be launched on the 7th, and 3D IC is still the focus of this exhibition. Promoter 2.5D and 3D IC technology is very positive. The general manager of the Sun Moonlight Group and Chief Research Officer Tang Heming said on the 6th that the semiconductor supply chain has been moving up in the past one year. Significant increase in related research and development resources of major manufacturers. The Wide-I/O Memory bus is also expected to be established before the end of the year in order to define the interface between memory and logic ICs. He expects 2013 to be the first year of mass production of 3D ICs.

For 2.5D and 3D ICs, Tang Heming said that the recent semiconductor supply chain has accelerated its investment in R&D. Many manufacturers have joined the R&D supply chain, including fabs, packaging and testing plants, etc. The cost of R&D in 3D ICs The increase in 2010 is a good thing for the development of the 3D industry chain. He predicted that 3D ICs should be expected to see mass production in 2013 and should be regarded as the first year of mass production of 3D ICs.

Tang Heming frankly stated that there are still many difficulties and challenges for 3D ICs that remain to be solved. For example, the cooperation among IC design, foundry, packaging and testing, systems, etc., needs to be strengthened and integrated; for example, in the aspect of testing, how can manufacturers improve their quality? This is also the key to testing the yield of the Known Good Die test. The entire semiconductor supply chain must solve these problems together.

For the packaging and testing industry, there has been a major breakthrough in the cooperation between the manufacturers of the front and rear segments, namely, the development of the Wide-I/O Memory bus. Tang Heming stated that the 3D era is focused on System-in-Package (SiP) stacking various ICs of different nature on a carrier board, such as logic ICs and memory. How these two heterogeneous ICs communicate with each other, which must define standards This, in turn, promotes the Wide-I/O Memory bus. This standard has been jointly developed by various semiconductor companies such as Intel, Qualcomm, Elpida, Samsung Electronics, and Riyueguang, and is expected to be completed before the end of the year.

Once the standard is established, there will be some reliance on production, which will help accelerate the mass production of 3D packaging. It is worth noting that Sun Moonlight actively promoted the development of the standard and made Taiwan also play an important role in the formulation of major standards.

Tang Heming said that 3D ICs and system-on-chip (SoC) technologies complement each other, and the integration of system functions through 3D ICs will increase the density and efficiency of ICs, lower their power consumption, and comply with environmental protection requirements. The use of 3D ICs will be mainly for mobile phones and tablet PCs, while 2.5D ICs will have larger die sizes, so the application side will begin with notebooks and desktop computers. The company is actively integrating with the semiconductor industry supply chain and is expected to introduce 3D IC volume production in 2013. It will be used in high-end products such as mobile phones, PCs, and medical doctors.

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