HDI Gradually Replaces Multilayer Capacity to Transfer to China

HDI Market Trend Analysis:

1 Based on the consumption upgrade, the application scope of HDI is becoming wider and wider. Along with the development trend of lightweight, integrated and multi-functionalization of consumer electronics products, the demand for PCB boards is getting higher and higher. Conforming to this trend, HDI has become the mainstream of consumer electronics PCBs due to features such as providing higher density circuit interconnections and being able to accommodate more electronic components.

Driven by consumer upgrades, HDI applications are no longer limited to mobile phones, digital cameras, digital cameras, etc. New consumer electronics products have spawned more HDI applications such as e-readers, smart phones, netbooks, GPS, MIDs, and automobiles. Hi-fi is using HDI. With the price drop, these products will gradually become popular, which will greatly promote the development of HDI.

2HDI products accounted for the overall proportion of PCB increased year by year, the fastest growth due to the continuous increase in new applications of HDI, while gradually replacing the ordinary multi-layer board in many products, HDI accounted for a higher proportion of PCB output value, becoming the fastest growing PCB fine Sub-domains.

From 2000 to 2008, the global HDI compound growth rate reached 14.9%, which is much higher than the other four PCB types. In 2008, the proportion of global HDI in PCB has reached 13%, and it has continued to increase. HDI is the most promising type of PCB field.

3 Based on the upgrade of functions, HDI gradually replaces multi-layer boards. In addition to the use of HDI for emerging electronic products, the original electronic products using ordinary multi-layer boards also gradually use HDI along with functional upgrades. Taking mobile phones, which account for nearly half of HDI applications, as an example, 3G and smart phones are gradually becoming the mainstream of mobile phones due to their scalability and richer applications. It is expected that 100% of mobile phone PCBs will adopt HDI in the future, and the proportion of second-order and third-order will continue to increase.

4 Transfer of Global HDI Capacity to Mainland China Currently, most of the HDI companies above the global scale are concentrated in Asia, such as China, Taiwan, South Korea and Japan. It is expected that Taiwan, South Korea and Japan will gradually shift their production capacity out of consideration for cost and environmental protection. In addition, the mobile phone, digital camera, notebook computer generation industry and global EMS outsourcing business will be transferred to mainland China. The proportion of HDI board production in China will further increase. .

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