Deyi plans to issue 3.5 billion U.S. dollars worth of bonds for the acquisition of National Semiconductor

According to foreign media reports, Texas Instruments (TI) announced on Monday that it will issue four bonds worth 3.5 billion U.S. dollars. Texas Instruments plans to use the majority of proceeds from the issuance of bonds to complete the acquisition of National Semiconductor.

Deyi said that it will issue 500 million U.S. dollars of two-year bonds with an interest rate of 0.875%; two-year bonds with floating interest of one billion U.S. dollars; three-year loans with interest rates of one billion U.S. dollars; 1.375%; and interest rates of two billion U.S. dollars % of 5-year bonds. It is expected that the issuance of bonds will end on May 23.

Texas Instruments’ underwriters for the bonds were Morgan Stanley, JP Morgan Chase, Merrill Lynch, Pierce, Fenner & Smith, and Citi Global Market. A small portion of the proceeds from the issuance of bonds will also be used for general corporate purposes.


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