Flip the edge of the future with an advantage

[Source: Gaogong LED's "LED Good Products" December issue (total 60th issue) Wen | Yang Jinglin] Flip-flops have an advantage over formal wear, but the biggest obstacle to the promotion of flip-chip products is the high price. Although the gold line is missing, the reduction of the gold line has little effect on reducing the price of flip-chip products. Secondly, the introduction of flip-chip technology has not made a big breakthrough and improvement in guiding heat dissipation.

Cui Tao related personnel introduced, "The current flip-chip technology market is not mature, and the future market trend is uncertain. Although many equipment manufacturers are paying close attention to the flip-chip market, but due to the influence of many uncertain factors, we have not made a big deal for the time being. The investment in research and development of flip-chip equipment."

Some industry personnel mentioned that the LED flip-chip package compared with the solid crystal wire bonding mode, which will probably account for 16% of the market share by 2020, while the solid crystal wire accounts for 84%. From this point of view, flip-chip future may become a segment of the LED packaging industry.

“So, the current industry's use of existing equipment for improvement for flip-chip packaging has become the first choice for flip-chip packaging equipment.” Ye Guangkai believes that the use of improved equipment in the industry is very reasonable.

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