Sensors and Instruments 2020 Target

Status and problems

The technology and products of sensors and instrumentation in China have been greatly improved through development. There are more than 1,600 enterprises and institutions in the country engaged in the research, development and production of sensors and instrument components. However, compared with foreign countries, the product variety and quality level of sensors and meter components in China cannot yet meet the needs of the domestic market. The overall level is still at the level of foreign countries in the early 1990s. The main problems that exist are:

(1) Poor scientific and technological innovation, the core manufacturing technology lags far behind that of foreign countries, there are few products with independent intellectual property rights, and the varieties are incomplete. The product technology level differs from that of foreign countries by about 15 years.
(2) The investment intensity is low, the research equipment and production technology equipment are backward, the achievement level is low, and the product quality is poor.
(3) The disconnect between science and technology and production, affecting the transformation of scientific research results, the overall strength is relatively low, and the potential for industrial development is insufficient.

Strategic objectives

By 2020, the field of sensors and instrumentation should strive to achieve three strategic goals:

With industrial control, automotive, communications and environmental protection as the key service areas, with sensors, flexible components, optical components, and special circuits as the key targets, we will develop original technologies and products with independent intellectual property rights;
Based on the MEMS process, relying on integrated, intelligent and networked technologies, the company will strengthen the development of manufacturing processes and new sensors and instrumentation components, so that the leading products will reach and approach the advanced level of similar foreign products;
To increase the variety, improve quality and economic efficiency as the main goal, accelerate industrialization, so that the domestic sensor and instrument components of the species share of 70% to 80%, high-end products up to 60%.

Development focus

Sensor Technology

(1) MEMS technology and a new generation of solid-state sensor microstructure manufacturing process: deep reactive ion etching (DRIE) process or IGP process; packaging process: such as normal temperature bonding flip-chip welding, stress-free micro-thin structure packaging, multi-chip assembly process; New sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors, automotive pressure, acceleration sensors, environmental protection micro-chemical sensors.
(2) Integrated process and multivariable composite sensor microstructure integrated manufacturing process; Multivariable composite sensors for industrial control, such as: pressure, static pressure, temperature three-variable sensors, pressure, wind, temperature, humidity four-variable sensors, micro silicon composite Strain pressure sensor, display sensor.
(3) Intelligent technology and intelligent sensor signals Wired or wireless detection, conversion processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies; smart multivariable sensors, smart power sensors and various smart sensors, transmission Device.
(4) Networked technologies and networked sensors and sensor network technologies; networked sensors enable the sensors to have industrial standard interfaces and protocol functions.

Instrumentation components

(1) Development and perfection of elastic elements New molding process: electrodeposition molding process, welding forming process; focus on the development of low-rigidity, large-displacement, long-life micro-precision bellows for aviation and aerospace, and bellows for high-temperature and high-pressure valves; Develop bellows efficient forming process equipment and performance testing instruments.
(2) Advanced technology for the development of optical components: aspherical optical component design, manufacturing technology, optical multilayer coating technology, and new ion-assisted coating technology.
Develop new optical components for optical fiber communication and digital imaging, such as: micro variable density filters, ultra-narrow band filters, micro lens arrays, large-area polarizing elements, and non-spherical glass-plastic hybrid lenses.
(3) Dedicated circuits to improve the design of specific circuit integration and personalized services and manufacturing processes;
Application software curing technology is developed to develop dedicated circuits for signal conversion, compensation, linearization, communications, and network interfaces for intelligent, networked sensors and instruments.