Weak mobile business, Freescale looks for partners
Freescale (Freescale) is about to double-check its weak mobile chip business. The company's CEO Rich Beyer said in an interview with the German Financial Times that he was considering several options.
The company is currently considering three options: finding a partner, selling the mobile wireless chip business, or continuing to operate this business independently. Beyer said that Freescale is negotiating with several potential partners, but he declined to disclose the timetable.
He also declined to say whether it is possible to work with Infineon, which is also at a loss. However, recent rumors in the media about the negotiations between the two companies have been widespread.
In addition to losses, Freescale also has huge debts. Therefore, cutting costs is the company's top priority. Beyer said he did not want to cut R & D expenses. But he plans to increase the efficiency of resource use, such as improving business processes and focusing on core businesses and markets.
As for the DRAM market situation, Beyer said, "When I wake up every morning, I am glad that we are not involved in the memory chip business."
10-layer Mobile Phone PCB Board, Base Material: FR4 TG180. inner/outer copper thickness 0.5/1 oz. Immersion Gold surface treatment with green colour solder mask. Board thickness 1.2 mm. Min.line width/Min.line spacing 0.75/0.75 mm. 4-up connect with the routed&mouse bit, 100% E-test pass. Have L1-L3, L8-L10 blind micro vias and L3-L8 buried holes. Vias in pad need to be filled with resin and copper cap. the distance between BGA PIN spacing only 0.4 mm. With impedance control.
Mobile Phone PCB Board
Mobile Phone PCB Board,PCB Board,Printed Circuit Board,Mobile Phone Circuit Board
Orilind Limited Company , https://www.orilind.com