IIC-Taiwan / CeraMicro announces eZigBee module with SiP technology
Optimistic about the diversified application opportunities of ZigBee, CeraMicro Technology (CeraMicro Technology) in the "2008 International Integrated Circuit Seminar and Exhibition" (IIC-Taiwan 2008) announced the chip-level packaging eZigBee solution. The new eZigBee module is integrated with SiP packaging technology, which can reduce the size of the module to 7mmx7mm, which brings customers the advantage of greatly reducing costs.
Zeng Minghuang, general manager of Porcelain Micro Technology, said that the current ZigBee has been widely used in home automation, industrial applications and medical industries, and its price has continued to decrease; however, the development of related solutions is quite complicated. Especially for service providers, when facing ZigBee system integration, they must also consider wireless system design, low-level software, chip processing, RF and PA selection, and overall system issues, etc. until the actual implementation is resolved When planning, the cost of investment often exceeds expectations.
In view of this, Porcelain Micro Technology has launched a competitive eZigBee solution. This fully functional RF module can effectively solve the problem of software and chip system compatibility, so that manufacturers no longer need to consider wireless design, software and chip system compatibility issues. The size of the eZigBee module is only 7mmx7mm, and the manufacturer can directly use it as a construction module of the ZigBee system to quickly and easily construct the WSN system to obtain a faster time to market, thereby reducing system costs.
eZigBee products can be divided into four categories, which can be given great flexibility of hardware according to different application needs of customers. The CZiP01 (CZ2410) system-on-a-chip is a transceiver module that integrates 8051 MCU, 16KB RAM and 128KB flash memory, and is compatible with 2.4GHz IEEE802.15.4. It is hardened for low power consumption and minimum processor cost. Body MAC accelerator and AES encryption.
The CF 2206 and CF 2268 RF front-end modules integrate high-efficiency and linear power amplifiers, RF switches, LNA and BPF, etc., greatly reducing board space and external components, and can be used as the best application for 2.4GHz ISM band to enhance output power. The device uses a 4.5mm x 4.5mm package design.
Zeng Minghuang said: "eZigBee is an application of embedded system as its name implies. And because ZigBee's application is mainly in some traditional industries, such as lighting manufacturers, curtains or window manufacturers, they often encounter some challenges in innovative applications. The eZigBee solution The reduction in RF, volume, and technology thresholds allows manufacturers to match sensors with their applications to achieve a complete product design, helping to reduce investment costs and increase benefits for these industry players. "
Therefore, Zeng Minghuang said that he is quite optimistic about ZigBee in the field of RF applications, which will help drive the innovation and development of traditional industries. "We started with modularization and designed a small and fully functional RF module solution, and the rest is left to customers for a variety of innovative applications, which will be the driving force behind the application of ZigBee in this field." In addition, the company will also release a complete software development kit (SDK) by the end of this year.
Via In Pad PCB
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.
Via In Pad PCB
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