In the winter in the north, we often feel electrostatic discharge (ESD). For example, when we open the door, we can feel the power of electrostatic discharge. In fact, when we feel the electric shock, the electrostatic voltage has exceeded 2000 volts; when we see the discharge spark, the electrostatic voltage has reached 5000 volts. Many VLSIs are damaged by electrostatic shocks of tens of volts or less relative to such high voltages. Therefore, ESD protection circuits have always been a problem that electronics engineers must consider. Industry insiders predict that in the next few years, new interfaces in applications such as computers and consumer electronics will have huge demand for ESD protection devices. To this end, component manufacturers have recently introduced a variety of new products to meet the market demand.
Fade out the low-cost mobile phone market, the market growth rate will reach 8% in the next three years
A big market for ESD devices was mobile phones three years ago, but this has changed. An industry insider told the China Electronics News that according to his understanding, ESD protection devices are basically not used in the design of low-end mobile phone products. The reason is that in the design process, where the electrostatic impact of the screen corner of the mobile phone is easy, the engineer generally uses the medium isolation method to avoid electrostatic shock.
However, Liu Jianfeng, manager of the discrete device technology department of Toshiba Electronics (Shanghai) Co., Ltd. believes that the main market for ESD protection devices is still in consumer electronics such as mobile phones, notebook computers and flat-panel TVs. "In fact, considering the existence of static electricity in the human body, the use of ESD protection devices is an inevitable trend." Liu Jianfeng said, "Just now some products are over-considered in cost, and the market is mainly in the south. In these places, the static electricity in the winter is different, some Mobile phone baseband chip manufacturers also have a tendency to integrate ESD protection devices into their chips. In combination with these factors, some mobile phones do not consider the use of ESD protection devices. But in general, the market for ESD protection devices, especially high-tech content / high added value The prospect of /small package ESD protection devices is still bright."
Lin Yushu, director of product marketing for NXP Semiconductors Greater China, further stated that regardless of whether mobile phone design engineers are considering the use of ESD protection devices, the limitations of anti-static capabilities of mobile phone main chips are becoming more and more integrated. The bigger the coming, the future application of mobile phones to ESD protection devices will continue to grow. "At the same time, we are very optimistic about the application of ESD protection devices in the new interface market of HDMI (High Definition Multimedia Interface), USB3.0 (Universal Serial Bus version 3.0), DisplayPort, etc. ESD protection for these high speed interfaces Design is a must, and these interfaces require higher performance ESD protection devices," Lin Yushu said. "Therefore, ESD protection devices should be multiplied year by year in these markets." "On ESD protection devices in wireless applications In terms of usage, we did see a trend in design changes in low-end phones. "Ms. Wang Weilun, Director of Marketing, Asia Pacific, Standard Products Division, ON Semiconductor, said, "But we have seen PDAs (Personal Digital Assistants) and other high-end phones for ESD. Demand for protective devices is increasing. At the same time, high-bandwidth ports such as HDMI and MDDI (mobile display digital interfaces) in LCD TVs and notebooks are increasingly demanding ESD protection devices. We expect to be in the future. Within three years, the total market value (TAM) of ESD protection devices will continue to grow at a CAGR of 8%."
Low-capacity products adapt to high-speed applications EMI and ESD integration solutions will be popular
From the type of ESD protection devices, some component companies provide protection devices for RC components, while others offer diode-type protection devices. From the perspective of technology trends, ESD protection devices have several characteristics:
First, manufacturers use different packaging technologies to provide smaller ESD protection devices. Smaller size ESD protection devices not only save space, but also reduce the cost of the device.
Second, suppliers develop low-capacitance ESD protection devices to meet the needs of high-speed applications. "The computer, wireless and home entertainment markets are shifting to high-speed interface standards such as HDMI 1.3 and USB 3.0," said Miss Anson Semiconductor, "The high-speed applications require lower capacitance ESD protection products to maintain data integrity. ""
Third, the market needs to integrate EMI (electromagnetic compatibility) ESD protection products. Many companies are developing or promoting such products. NXP has introduced a solution that combines ESD protection and EMI filtering in a leadless package. According to NXP, a highly integrated solution can reduce board space, simplify design, shorten design cycles, and reduce the hidden costs of discrete solutions in production inspections, such as feed inspection. These advantages will greatly expand the scope of application of the program.
Fourth, since some radio frequency (RF) applications are affected by the addition of diode-type ESD protection devices, the receiving sensitivity is affected. Therefore, the market also needs ESD protection products that support radio frequency (RF) applications. It is reported that Murata is using ceramic technology to develop related products.
The fifth is the built-in ESD protection function of different interfaces. Maxim has launched a series of interface products with built-in ESD protection. "This device is more expensive than a normal non-protective device, but the added cost is lower than the cost of a protective diode." Maxim's Beijing office said, "And the internal integrated ESD protection circuit does not add any The equivalent capacitance of the input and output pins also saves board area."
In addition, technical trends in ESD protection devices include increased withstand voltage, reduced clamping voltage, and easier wiring.
New products frequently listed manufacturers set off a new wave of supply
Although the demand for ESD protection devices is not high in the low-end mobile phone market, new interfaces in applications such as computers, high-end mobile phones and consumer electronics (television, set-top boxes, etc.) have placed a lot of new demands on ESD protection devices, and manufacturers are very optimistic. This type of ESD protection device market has recently launched new ESD protection products.
For example, Tyco Electronics introduced three new products in the 0201 CSP package in September this year. Among them, the 0201 size silicon-based ESD (SESD) device is about 70% smaller than the previous generation 0402 device, and the size is only 0.6mm × 0.3mm × 0.3mm. The typical capacitance value of SESD0402S-005-05 is 0.5pF ( Pifa) for digital interface applications such as USB and HDMI. In September this year, STMicroelectronics introduced the HDMI chip with built-in ESD protection and HDMI version 1.3 requirements - HDMI2C1-5DIJ. The new product reduces board space by up to 70%. In April of this year, NXP introduced a series of solutions that combine 30dB EMI filtering and 30kVESD protection in ultra-thin lead-free package (UTLP). This series is especially suitable for providing EMI/RFI filtering and ESD protection in mobile and portable applications. In April of this year, ON Semiconductor also introduced low-capacitance ESD protection products NUP4016 and ESD11L5.0D. The device has an ultra-low capacitance of 0.5pF per I/O line.
Fade out the low-cost mobile phone market, the market growth rate will reach 8% in the next three years
A big market for ESD devices was mobile phones three years ago, but this has changed. An industry insider told the China Electronics News that according to his understanding, ESD protection devices are basically not used in the design of low-end mobile phone products. The reason is that in the design process, where the electrostatic impact of the screen corner of the mobile phone is easy, the engineer generally uses the medium isolation method to avoid electrostatic shock.
However, Liu Jianfeng, manager of the discrete device technology department of Toshiba Electronics (Shanghai) Co., Ltd. believes that the main market for ESD protection devices is still in consumer electronics such as mobile phones, notebook computers and flat-panel TVs. "In fact, considering the existence of static electricity in the human body, the use of ESD protection devices is an inevitable trend." Liu Jianfeng said, "Just now some products are over-considered in cost, and the market is mainly in the south. In these places, the static electricity in the winter is different, some Mobile phone baseband chip manufacturers also have a tendency to integrate ESD protection devices into their chips. In combination with these factors, some mobile phones do not consider the use of ESD protection devices. But in general, the market for ESD protection devices, especially high-tech content / high added value The prospect of /small package ESD protection devices is still bright."
Lin Yushu, director of product marketing for NXP Semiconductors Greater China, further stated that regardless of whether mobile phone design engineers are considering the use of ESD protection devices, the limitations of anti-static capabilities of mobile phone main chips are becoming more and more integrated. The bigger the coming, the future application of mobile phones to ESD protection devices will continue to grow. "At the same time, we are very optimistic about the application of ESD protection devices in the new interface market of HDMI (High Definition Multimedia Interface), USB3.0 (Universal Serial Bus version 3.0), DisplayPort, etc. ESD protection for these high speed interfaces Design is a must, and these interfaces require higher performance ESD protection devices," Lin Yushu said. "Therefore, ESD protection devices should be multiplied year by year in these markets." "On ESD protection devices in wireless applications In terms of usage, we did see a trend in design changes in low-end phones. "Ms. Wang Weilun, Director of Marketing, Asia Pacific, Standard Products Division, ON Semiconductor, said, "But we have seen PDAs (Personal Digital Assistants) and other high-end phones for ESD. Demand for protective devices is increasing. At the same time, high-bandwidth ports such as HDMI and MDDI (mobile display digital interfaces) in LCD TVs and notebooks are increasingly demanding ESD protection devices. We expect to be in the future. Within three years, the total market value (TAM) of ESD protection devices will continue to grow at a CAGR of 8%."
Low-capacity products adapt to high-speed applications EMI and ESD integration solutions will be popular
From the type of ESD protection devices, some component companies provide protection devices for RC components, while others offer diode-type protection devices. From the perspective of technology trends, ESD protection devices have several characteristics:
First, manufacturers use different packaging technologies to provide smaller ESD protection devices. Smaller size ESD protection devices not only save space, but also reduce the cost of the device.
Second, suppliers develop low-capacitance ESD protection devices to meet the needs of high-speed applications. "The computer, wireless and home entertainment markets are shifting to high-speed interface standards such as HDMI 1.3 and USB 3.0," said Miss Anson Semiconductor, "The high-speed applications require lower capacitance ESD protection products to maintain data integrity. ""
Third, the market needs to integrate EMI (electromagnetic compatibility) ESD protection products. Many companies are developing or promoting such products. NXP has introduced a solution that combines ESD protection and EMI filtering in a leadless package. According to NXP, a highly integrated solution can reduce board space, simplify design, shorten design cycles, and reduce the hidden costs of discrete solutions in production inspections, such as feed inspection. These advantages will greatly expand the scope of application of the program.
Fourth, since some radio frequency (RF) applications are affected by the addition of diode-type ESD protection devices, the receiving sensitivity is affected. Therefore, the market also needs ESD protection products that support radio frequency (RF) applications. It is reported that Murata is using ceramic technology to develop related products.
The fifth is the built-in ESD protection function of different interfaces. Maxim has launched a series of interface products with built-in ESD protection. "This device is more expensive than a normal non-protective device, but the added cost is lower than the cost of a protective diode." Maxim's Beijing office said, "And the internal integrated ESD protection circuit does not add any The equivalent capacitance of the input and output pins also saves board area."
In addition, technical trends in ESD protection devices include increased withstand voltage, reduced clamping voltage, and easier wiring.
New products frequently listed manufacturers set off a new wave of supply
Although the demand for ESD protection devices is not high in the low-end mobile phone market, new interfaces in applications such as computers, high-end mobile phones and consumer electronics (television, set-top boxes, etc.) have placed a lot of new demands on ESD protection devices, and manufacturers are very optimistic. This type of ESD protection device market has recently launched new ESD protection products.
For example, Tyco Electronics introduced three new products in the 0201 CSP package in September this year. Among them, the 0201 size silicon-based ESD (SESD) device is about 70% smaller than the previous generation 0402 device, and the size is only 0.6mm × 0.3mm × 0.3mm. The typical capacitance value of SESD0402S-005-05 is 0.5pF ( Pifa) for digital interface applications such as USB and HDMI. In September this year, STMicroelectronics introduced the HDMI chip with built-in ESD protection and HDMI version 1.3 requirements - HDMI2C1-5DIJ. The new product reduces board space by up to 70%. In April of this year, NXP introduced a series of solutions that combine 30dB EMI filtering and 30kVESD protection in ultra-thin lead-free package (UTLP). This series is especially suitable for providing EMI/RFI filtering and ESD protection in mobile and portable applications. In April of this year, ON Semiconductor also introduced low-capacitance ESD protection products NUP4016 and ESD11L5.0D. The device has an ultra-low capacitance of 0.5pF per I/O line.
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